DT-C01 AI Intelligent Processing Core Board

Product Features

• Equipped with powerful super-resolution capability, it can upgrade 640 × 512 resolution images to 1K~4K high-definition resolution, synchronously enhance detail textures and edge contours, and achieve instant high-definition of low definition infrared images.

• The processor is equipped with an NPU engine, providing 4T computing power support. After distillation and quantization optimization, the super-resolution model can perform real-time inference at the edge at a rate of 30fps.

• Integrated self-developed advanced infrared AI algorithm, covering functions such as infrared image denoising, enhancement, super-resolution, target detection and tracking.

• Based on deep convolution and Transformer network architecture, high-resolution infrared images can be output in real time, and even small targets at long distances can maintain clear contours.

• Support multiple video access methods and serial port control such as UVC, MIPI, Ethernet, etc; The output methods cover network, HDMI, and UVC video output, and support local TF card and NVME storage.

• The structure is lightweight and adopts a 38mm small double-layer board design, which is easy to integrate into various cameras and optoelectronic systems.

Product Application

It can be applied in fields such as unmanned aerial vehicles, vehicle night vision, security monitoring, and industrial inspection.

Infrared super-resolution effect

640 * 512 resolution infrared image effect (before super-resolution)                   Super score effect

Technical Specifications